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Datenschutz bei Stromausfall, Enterprise Data Path Protection, Firmware-Upgrade ohne Reset, Secure Erase-Funktion, Secure Boot, Secure Firmware, Active Garbage Collection, TRIM-Unterstützung, Self-Encrypting Drive (SED), Digitally Signed Firmware, NAND Block Erase, Cryptographic Erase, DMA unterstützt, 176-Layer 3D TLC NAND Technologie